JEDEC Solid State Technology Association

Jedec continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface, wide bandgap, and more. In 2023, Jedec published 10 complete standards, 6 publications, 2 joint standards and one joint reference document, 17 registration outlines, 4 memory device specifications, and one memory module design file registration. An additional 48 standards and publications received updates.

Jedec held a mobile, iot and server forum in in may 2023 in seoul, korea and hsinchu, taiwan. Jedec also held two informational sessions at the flash memory summit in august in santa clara, ca. In september, Jedec held an automotive electronics forum in san jose, ca. In addition, 25 committee meetings were held during the year.

The marketing and communications department was active this year in the promotion of Jedec's major standards announcements, resulting in prominent coverage in major industry publications.jedec continued its longstanding partnership with smartbrief to ensure the continued popularity of the Jedec smartbrief daily email newsletter, providing increased awareness for the Jedec brand, standards and ongoing activities.